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IPO Detail
09630 芯碁微裝
CFMEE
Register Close2026/06/23    IPO Closing in 5 Days
Listing Date2026/06/26
COMPANY PROFILE

Circuit Fabology Microelectronics Equipment Co. is the largest provider of PCB direct imaging equipment globally, delivering PCB direct imaging equipment and semiconductor direct-writing lithography equipment in the age of AI.

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The Group’s main products include PCB direct imaging equipment and automation system; semiconductor direct-writing lithography equipment and automation system; and comprehensive after-sales maintenance and support services of the above products; its customers were mainly PCB and semiconductor manufacturers, while a small proportion of its customers were distributors.

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According to the report, the Group ranked fourth among global direct-writing lithography equipment suppliers, with a market share of 9.4% by revenue in 2025, and it is the largest provider of PCB direct imaging equipment globally, with a market share of 18.8% by revenue in 2025.

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As of June 8, 2026, the Group had one production base in Hefei, China, comprising Phase I and Phase II. The Hefei Production Base (Phase I) commenced operations in 2021 and specializes in production of high-end PCB direct imaging equipment, wafer-level packaging direct imaging lithography equipment and FPD equipment. The Hefei Production Base (Phase II) commenced initial trial operation in September 2025 and specializes in the production of automation system, high-end PCB direct imaging equipment, laser drilling equipment, wafer-level packaging direct imaging lithography equipment and FPD equipment. It produced 48 automated production lines to support 96 LDI units as of December 31, 2025.

BASIC INFORMATION
MarketHong Kong (Main Board)
Business NatureIT Hardware
Major Business AreaChina
Board Lot50
GLOBAL OFFERING
No. of Offer Shares12.84M H shares
No. of International Offer Shares11.55M H shares
No. of HK Offer Shares1.28M H shares
Offer Price$240.09 - $252.73
Stock Code9630
Sponsor(s)China International Capital Corporation Hong Kong Securities Limited
Underwriter(s)China International Capital Corporation Hong Kong Securities Limited, CMB International Capital Limited, Guoyuan Securities Brokerage (Hong Kong) Limited, BOCI Asia Limited, Futu Securities International (Hong Kong) Limited
TIME TABLE
Application PeriodJun 17 (Wed) - noon, Jun 23 (Tue)
Price Determination DateJun 24 (Wed)
Result Announcement DateOn or before Jun 25 (Thu)
Result Announcement DateOn or before Jun 25 (Thu)
Result Announcement DateOn or before Jun 26 (Fri)
Dealings in Shares commence onJun 26, 2026. (Fri)
Reallocation of Shares Offered
Sales Statistics (HKD)
Offer Price$240.09 - $252.73
Capitalization (H Shares)3.08B - 3.24B
NAV / share ($)$39.01 - $40.11 (Unaudited pro forma adj NAV / share)
Use Of Proceeds
Assuming the offer price being at HKD 246.41, the net proceeds raised would be HKD 3.07B, of which
25% : Strengthen research and development capabilities
18% : Expand overall production capacity
27% : Strategic investments and/or acquisitions
20% : Expand international sales presence and develop overseas sales and service network
10% : Working capital
Related Document
Remark: The above information is referenced from the prospectus.
  All data is calculated from the non- exercise rights(if applicable).
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