07672 芯德半導體
XINDE SEMI
XINDE SEMI
| Register Close | 2026/11/05 IPO Closing Tomorrow |
| Listing Date | 2026/11/10 |
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IPO Detail
COMPANY PROFILE
Jiangsu Xinde Semiconductor Technology Co., Ltd. is a provider of semiconductor assembly and testing services, principally engaged in developing packaging design, offering customized packaging products as well as packaging product testing service.
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The Group's general-purpose OSAT provides advanced packaging and testing services for a broad range of chips deployed across diverse industries, with flexible technical capabilities to accommodate varied customer requirements. According to Frost & Sullivan, the Group ranked seventh among China’s general-purpose OSAT companies in terms of revenue from semiconductor advanced packaging and testing in 2025, with a market share of 0.6%.
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As of October 12, 2026, the Group owned 232 patents in the PRC, comprising 41 invention patents and 191 utility model patents, covering key areas such as packaging structures, methods, equipment and testing systems.
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The Group's customers primarily include upstream direct customers, namely fabless semiconductor companies.
BASIC INFORMATION
| Market | Hong Kong (Main Board) |
| Business Nature | Semiconductors |
| Major Business Area | China |
| Board Lot | 500 |
GLOBAL OFFERING
| No. of Offer Shares | 106.56M H shares |
| No. of International Offer Shares | 95.91M H shares |
| No. of HK Offer Shares | 10.66M H shares |
| Offer Price | $8.60 - $9.60 |
| Stock Code | 7672 |
| Sponsor(s) | Huatai Financial Holdings (Hong Kong) Limited |
| Underwriter(s) | Huatai Financial Holdings (Hong Kong) Limited, Huafu International Securities Limited, First Shanghai Securities Limited, SDIC Securities (Hong Kong) Limited, China Galaxy International Securities (Hong Kong) Co., Limited, CNCB (Hong Kong) Capital Limited, SPDB International Capital Limited, CMBC Securities Company Limited, Winbull Securities International (HK) Limited, Emperor Securities Limited |
TIME TABLE
| Application Period | Oct 30 (Fri) - noon, Nov 05 (Thu) |
| Price Determination Date | Nov 06 (Fri) |
| Result Announcement Date | On or before Nov 09 (Mon) |
| Result Announcement Date | On or before Nov 09 (Mon) |
| Result Announcement Date | On or before Nov 10 (Tue) |
| Dealings in Shares commence on | Nov 10, 2026. (Tue) |
Reallocation of Shares Offered
Sales Statistics (HKD)
| Offer Price | $8.60 - $9.60 |
| Capitalization (H Shares) | 6.88B - 7.68B |
| NAV / share ($) | $2.12 - $2.22 (Unaudited pro forma adj NAV / share) |
Use Of Proceeds
| Assuming the offer price being at HKD 9.1, the net proceeds raised would be HKD 904.30M, of which |
| 69.5% : Construction of production base and new production lines and procurement of production-related equipment |
| 17.6% : Enhancing research and development capabilities in advanced packaging technologies with a particular focus on the advancement of packaging and testing technologies for CAPiC platform |
| 2.9% : Enhancing commercialization capabilities and expanding customer collaboration ecosystem |
| 10% : Working capital |
Related Document
| Prospectus |  Chinese Version | English Version |
| Remark： | The above information is referenced from the prospectus. |
| All data is calculated from the non- exercise rights(if applicable). |
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*Admission fees include brokerage of 1%, SFC transaction levy of 0.0027%, Stock Exchange trading fee of 0.005% and FRC transaction levy of 0.00015% (i.e. 1.0077% in total).