02681 宏芯宇
HOSIN ELEC
HOSIN ELEC
| Register Close | 2026/11/09 IPO Closing in 5 Days |
| Listing Date | 2026/11/12 |
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IPO Detail
COMPANY PROFILE
HOSIN Electronics Co., Ltd. is a memory product enterprise. The Group develops, manufactures (primarily through outsourcing wafer processing to third-party foundries and assembly, packaging and testing to third-party OSAT providers) and sells memory solutions by leveraging its technology platform spanning controller chip design and development, firmware algorithm development, test system development, and storage medium characteristic analysis.
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The Group's products offerings mainly comprise embedded storage, including eMMC, UFS, ePOP and uMCP, used in consumer devices such as smartphones, tablets and wearables as well as certain automotive applications; SSD products across SATA and PCIe lines for PCs, servers and data-center/automotive-related use cases; DRAM products, including DDR and LPDDR products used in smartphones and PCs; mobile storage products such as USB flash drives and SD/microSD cards, and memory IC products, including NAND Flash and DRAM wafers and dies.
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The Group's customers include smartphone and tablet manufacturers, wearable device manufacturers, module manufacturers, Tier 1 suppliers, automobile manufacturers and computer manufacturers.
BASIC INFORMATION
| Market | Hong Kong (Main Board) |
| Business Nature | Semiconductors |
| Major Business Area | -- |
| Board Lot | 100 |
GLOBAL OFFERING
| No. of Offer Shares | 14.72M H shares |
| No. of International Offer Shares | 13.25M H shares |
| No. of HK Offer Shares | 1.47M H shares |
| Offer Price | $72.29 - $82.90 |
| Stock Code | 2681 |
| Sponsor(s) | China Securities (International) Corporate Finance Company Limited |
| Underwriter(s) | China Securities (International) Corporate Finance Company Limited, BOCI Asia Limited, DBS Asia Capital Limited, Futu Securities International (Hong Kong) Limited, Tiger Brokers (HK) Global Limited |
TIME TABLE
| Application Period | Oct 30 (Fri) - noon, Nov 09 (Mon) |
| Price Determination Date | Nov 10 (Tue) |
| Result Announcement Date | On or before Nov 11 (Wed) |
| Result Announcement Date | On or before Nov 11 (Wed) |
| Result Announcement Date | On or before Nov 12 (Thu) |
| Dealings in Shares commence on | Nov 12, 2026. (Thu) |
Reallocation of Shares Offered
Sales Statistics (HKD)
| Offer Price | $72.29 - $82.90 |
| Capitalization | 34.88B - 40.00B |
| NAV / share ($) | $20.55 - $20.87 (Unaudited pro forma adj NAV / share) |
Use Of Proceeds
| Assuming the offer price being at HKD 77.6, the net proceeds raised would be HKD 1.05B, of which |
| 40% : Development and commercialization of memory products |
| 35% : Development and iteration of the controller chips |
| 15% : Enhancing wafer and controller chip validation and testing capabilities |
| 10% : Working capital |
Related Document
| Prospectus |  Chinese Version | English Version |
| Remark： | The above information is referenced from the prospectus. |
| All data is calculated from the non- exercise rights(if applicable). |
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Listing --Offer Price︰--
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*Admission fees include brokerage of 1%, SFC transaction levy of 0.0027%, Stock Exchange trading fee of 0.005% and FRC transaction levy of 0.00015% (i.e. 1.0077% in total).